Clip-bonding technology replaces the standard wire-bond connection between die and lead by a solid copper bridge, soldered by solder paste, which offers unique package resistance, better thermal resistance, and ultra-fast switching performance due to the small package.

By using MPT technology, the adhesive strength is increased to improve the reliability of the package. Fine engraving pattern technology refers to creating a fine engraved pattern on the metal surface of a semiconductor material to increase the bonding force with the encapsulant to prevent peeling of the metal surface.

In the field of power electronics increasingly high-performance modules using SiC is produced with the help of ultrasonic welding. Ultrasonic welding of the load and control connections to substrates offers full process and quality monitoring compared to conventional soldering. In reliability tests, ultrasonically welded power modules last up to ten times longer.

The press-fit technology utilizes press-fit pins to establish the module contacts to the printed circuit board. The basic principle is the bigger latitude of the press-in zone than of the PCB hole. This technology ensures easy and fast mounting of the module and PCB, reducing assembly time and cost by eliminating the solder process.

Multilayer Ceramic Capacitor (MLCC) works as a 'dam' that temporarily charges and discharges electricity. It regulates the current's flow in a circuit and prevent electromagnetic interference between components.

Coupled Power Package applied to IH system with WBG Power Device